CPU |
Intel® Socket 2066 Core™ X-Series Processors
Supports Intel® Virtual RAID on CPU (VROC)
|
Chipset |
Intel® X299 |
Memory |
Intel® Core™ X-series Processors (6-core above) 8 x DIMM, Max. 256GB, DDR4 4266(O.C.)/4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2933/2666/2400 MHz Non-ECC, Un-buffered Memory Supports Intel® Extreme Memory Profile (XMP) * Hyper DIMM support is subject to the physical characteristics of individual CPUs. * Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU. |
Multi-GPU Support |
Supports NVIDIA® 4-Way SLI® Technology
Supports AMD 4-Way CrossFireX Technology
|
Expansion Slots |
7 x PCIe 3.0/2.0 x16 (single x16 or dual x16/x16 or triple x16/x16/x16 or quad x16/x16/x16/x16 or seven x16/x8/x8/x8/x8/x8/x8) |
Storage |
Intel® X299 Chipset : 1 x M.2_1 socket 3, with M Key, type 2242/2260/2280/22110 storage devices support (both SATA & PCIE mode) 1 x M.2_2 socket 3, with M Key, type 2242/2260/2280 storage devices support (PCIE mode only) 8 x SATA 6Gb/s port(s) 3 x U.2 connector Support Raid 0, 1, 5, 10 Support Intel® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID Supports Intel® Smart Response Technology Intel® Rapid Storage Technology 15 support Intel® Optane™ Memory Ready Intel® Virtual RAID (VROC) support for CPU RAID |
LAN |
Intel® I225-LM |
Audio |
Realtek® S1200A 7.1-Channel High Definition Audio CODEC - Impedance sense for front and rear headphone outputs - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers - Supports : Jack-detection, Multi-recording, Front Panel MIC Jack-retasking - High quality 120 dB SNR stereo playback output (Line-out at rear) and 113 dB (Line-in) Audio Feature : - DTS Connect - DTS Headphone:X - DTS X®:Ultra - Audio amplifier: Provides the highest-quality sound for headphone and speakers - Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity - Unique de-pop circuit: Reduces start-up popping noise to audio outputs Separate layer for left and right track, ensuring both sound deliver equal quality |
USB Ports |
Intel® X299 Chipset : 8 x USB 3.2 Gen 1 port(s) (6 at back panel, , 2 at mid-board) Intel® X299 Chipset : 4 x USB 2.0 port(s) (4 at back panel, ) ASMedia® USB 3.2 Gen 2 controller : 2 x USB 3.2 Gen 2 port(s) (2 at back panel, , Type-A + USB Type-CTM) ASMedia® USB 3.2 Gen 2 controller : 1 x USB 3.2 Gen 2 port(s) (1 at mid-board) |
Special Features |
OC Design - ASUS PRO Clock II Technology 5-Way Optimization by Dual Intelligent Processors 5 - 5-Way Optimization tuning key perfectly consolidates TPU, EPU, DIGI+ Power Control, Fan Xpert 3, and Turbo App TPU
Fan Xpert4 - Fan Xpert 4 featuring Fan Auto Tuning function and multiple thermistors selection for optimized system cooling control ASUS 5X Protection III : - ASUS SafeSlot Core: Fortified PCIe Slot prevents damage - ASUS Overvoltage Protection: World-class circuit-protecting power design - ASUS Stainless-Steel Back I/O: 3X corrosion-resistance for greater durability! - ASUS Enhanced DRAM Overcurrent Protection - Short circuit damage prevention - ASUS ESD Guards - Enhanced ESD protection ASUS EPU : - EPU ASUS Digital Power Design : - Industry leading Digital 8 Phase CPU Power Design - Industry leading Digital 2 Phase DRAM Power Design AURA : - Aura RGB Strip Headers - Aura Addressable Strip Header(s) ASUS Exclusive Features : - AI Suite 3 - Ai Charger+ - Crystal Sound 3 ASUS EZ DIY : - ASUS CrashFree BIOS - ASUS EZ Flash - ASUS USB BIOS FlashBack™ - Multi-language BIOS ASUS Q-Design : - ASUS Q-Shield - ASUS Q-Cable - ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED) - ASUS Q-Slot - ASUS Q-DIMM - ASUS Q-Connector M.2 and U.2 Onboard (The Latest Transfer Technology with up to 32Gb/s Data-transfer Speeds for M.2 and U.2) Thunderbolt 3 support
|
Back I/O Ports |
2 x LAN (RJ45) port(s) 1 x USB 3.2 Gen 2(teal blue)Type-A 1 x USB 3.2 Gen 2 (black)USB Type-CTM, 6 x USB 3.2 Gen 1 (blue) 4 x USB 2.0 (one port can be switched to USB BIOS FlashBack™) 1 x Optical S/PDIF out 1 x USB BIOS FlashBack™ Button(s) 1 x 8-channel Audio I/O |
Internal I/O Ports |
2 x CPU Fan connector(s) 2 x Chassis Fan connector(s) 2 x Addressable RGB header 1 x AAFP connector 2 x Aura RGB Strip Headers 1 x M.2 Socket 3 with M key, type 2242/2260 storage devices support (both SATA & PCIE mode) 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (PCIE mode only) 1 x TPM header 8 x SATA 6Gb/s connector(s) 1 x VROC_HW_Key 1 x AIO_PUMP connector 1 x Thunderbolt header(s) 1 x 24-pin EATX Power connector(s) 2 x 8-pin ATX 12V Power connector(s) 1 x Power-on button(s) 1 x Reset button(s) 1 x Clear CMOS button(s) 3 x U.2 connector 1 x System panel connector 1 x COM port header 1 x W_Pump+ Header 1 x Thermal sensor connector 1 x CPU_OV jumper 1 x M.2 Fan Header 1x 6-pin ATX 12V Power connector 1 x USB 3.2 Gen 2 (up to 10Gbps) connector 1 x USB 3.2 Gen 1 (up to 5Gbps) connector support additional 2 USB ports 3 x U.2 LED switch header |
Accessories |
User´s manual Addressable LED extension cable 1 x Vertical M.2 bracket set I/O Shield 1 x COM port cable(s) 8 x SATA 6Gb/s cable(s) 1 x M.2 screws 1 x Supporting DVD 1 x MOS Cooling kit (fan bracket and 40mm x 40mm fan) 1 x 3-Way SLI bridge(s) 1 x 4-Way SLI bridge(s) 1 x SLI HB BRIDGE(2-WAY-M) 1 x Q-connector(s) (0 in 1) |
Operating System |
Windows® 10 64-bit |
Form Factor |
CEB Form Factor 12 inch x 10.5 inch ( 30.5 cm x 26.7 cm ) |
Weight |
Color Box(3-in-1) Net Weight: 5.55kg Gross Weight: 8.06kg
Bulk Pack(5-in-1) Net Weight: 6.99kg Gross Weight: 9.37kg
|
Environment |
Operation temperature: 10℃ ~ 35℃ Non operation temperature: -40℃ ~ 70℃ Non operation humidity: 20% ~ 90% ( Non condensing) |
Warranty |
3 Years |
Note |
*** Features, Price, Specifications are subject to change without notice. |