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Product Description
FEATURES:
T9+ Platinum Thermal Grease Kit
Alseye T9+ Platinum,
for your high-end gaming devices !!!
- Non-curing materials
- High thermal conductivity
- Able to achieve very thin bond line thickness
- Low thermal resistance
- Thixotropic, low slump
- Low volatile
90% of the CPU temperature increase is due to the loss of thermal paste performance, not because of the heatsink dust or cooling fan performance degradation.
Outstanding Thermal Management
T9+ Platinum is formulated with thermally conductive filler particles and optimized silicone polymers to inprove the performance and reliability.
T9+ Platinum Thermal Conductivity
Conductive filler particles and optimized silicone polymers create an uninterrupted, thermally-conductive path between CPU & heatsink.
Long-term Material Stability
T9+ Platinum stays strong over the full operating cycle of your gaming hardware, exhibiting minimal evaporation over a wide operating temperature range----even in a vacuum atmosphere (10-5 tor/mil, 24hrs@100℃).
Alseye T9+ Platinum
For top builds and high-end setups
Offering high thermal conductivity of 13.5 W/mK and the ability to achieve a very thin bond line thickness of approximately 18 um,
Thermally Conductive Compound yields low thermal resistance of 0.038℃-cm²/ W
SPECIFICATION:
| Model | T9+ Platinum Kit |
| Color | Gray |
| MAIN | |
| Electrical Conductivity | No |
| Volume | 5g |
| One Part Material | Non-curing |
| Viscosity at Low Strain Rate | 1,200 Pa-s |
| Viscosity at High Strain Rate | 100 Pa-s |
| Specific Gravity | 2.6 |
| Volatile Content, 48 hours at 125°C | 0.02% |
| Thermal Conductivity | 13.5W/m-K |
| Thermal Resistance at 25 N/cm² | 0.04 ℃-cm²/ W |
| Bond Line Thickness at 25 N/cm² | 0.02 mm (0.0008 in) |
| Packing List | T9 + Platinum Edition Thermal Grease Shovel Brush Cleaner Finger Sleeve Wipe Cloth Fan Bearing Oil |
| Note | *** Features, Price, Specifications are subject to change without notice. |