T9+ Platinum Thermal Grease Kit
Alseye T9+ Platinum,
for your high-end gaming devices !!!
- Non-curing materials
- High thermal conductivity
- Able to achieve very thin bond line thickness
- Low thermal resistance
- Thixotropic, low slump
- Low volatile
90% of the CPU temperature increase is due to the loss of thermal paste performance, not because of the heatsink dust or cooling fan performance degradation.
Outstanding Thermal Management
T9+ Platinum is formulated with thermally conductive filler particles and optimized silicone polymers to inprove the performance and reliability.
T9+ Platinum Thermal Conductivity
Conductive filler particles and optimized silicone polymers create an uninterrupted, thermally-conductive path between CPU & heatsink.
Long-term Material Stability
T9+ Platinum stays strong over the full operating cycle of your gaming hardware, exhibiting minimal evaporation over a wide operating temperature range----even in a vacuum atmosphere (10-5 tor/mil, 24hrs@100℃).
Alseye T9+ Platinum
For top builds and high-end setups
Offering high thermal conductivity of 13.5 W/mK and the ability to achieve a very thin bond line thickness of approximately 18 um,
Thermally Conductive Compound yields low thermal resistance of 0.038℃-cm²/ W
|T9+ Platinum Kit
|One Part Material
|Viscosity at Low Strain Rate
|Viscosity at High Strain Rate
|Volatile Content, 48 hours at 125°C
|Thermal Resistance at 25 N/cm²
|0.04 ℃-cm²/ W
|Bond Line Thickness at 25 N/cm²
|0.02 mm (0.0008 in)
|T9 + Platinum Edition Thermal Grease Shovel Brush Cleaner Finger Sleeve Wipe Cloth Fan Bearing Oil
|*** Features, Price, Specifications are subject to change without notice.