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Features:
- Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
- Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution
- Dual Channel DDR5:4*DIMMs XMP Memory Module Support
- Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
- M.2 Thermal Guard:To Ensure M.2 SSD Performance
- EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design
- Fast Networks:2.5GbE LAN
- Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI
- Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
Specification:
Model | B760M DS3H |
CPU |
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Chipset | Intel® B760 Express Chipset |
Memory |
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Onboard Graphics |
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Audio |
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LAN | Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
Expansion Slots |
CPU: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 Chipset: 2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1 |
Storage Interface |
CPU: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB) RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices |
USB |
Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers |
Internal I/O Connectors |
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Back Panel Connectors |
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I/O Controller | iTE® I/O Controller Chip |
H/W Monitoring |
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BIOS |
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Unique Features |
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Bundled Software |
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Operating System |
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Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm |
Warranty | 3 Years |
Note | *** Features, Price, Specifications are subject to change without notice. |
Motherboard | |
Platform | INTEL |
Socket | LGA1700 |
Chipset | B760 |
Max Memory Support | 192 GB |
Supported Memory Type | DDR5 |
Form Factor | M-ATX |