AMD X570 AORUS Motherboard with Direct 16 Phases Infineon Digital VRM, Fins-Array Heatsink, NanoCarbon Baseplate, Triple PCIe 4.0 M.2 with Thermal Guards, Intel® WiFi 6 802.11ax, ESS SABRE HiFi 9218, AQUANTIA® 10GbE LAN+1GbE LAN, RGB FAN COMMANDER, RGB Fusion 2.0
- Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- Direct 16 Phases Infineon Digital VRM Solution with 70A Power Stage
- Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate
- Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
- Onboard Intel® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
- Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors
- AQUANTIA® 10GbE BASE-T LAN + Intel® Gigabit LAN with cFosSpeed
- Exclusive RGB FAN COMMANDER for Professional Casemoders
- USB TurboCharger for Mobile Device Fast Charge Support
- RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
- Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
- Front & Rear USB 3.2 Gen 2 Type-C™ Headers
- Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
Innovative design, cutting-edge function, state-of-art aesthetics, sophisticated thermal design, next generation network connection ,Hi-Fi level audio system. X570 AORUS XTREME is the new definition of flagship motherboard.
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users' computing behaviors
Extreme Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, X570 AORUS XTREME is a true beast among motherboards.
THERMAL REACTIVE ARMOR
X570 AORUS XTREME uses some unprecedented and innovative thermal design to ensure CPU, Chipset, SSD stability and low temperature under full loading application and gaming.
Hungry for better performance? X570 AORUS XTREME has full PCIe 4.0 design, supports high frequency memory, and full SSD thermal guard to make sure you get the maximum full system performance.
Next Generation Connectivity
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS XTREME provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
GIGABYTE ID team designs X570 AORUS XTREME from the drawing board. After countless hours of conceptualizing ideas, fine tuning details and engaging in discussion, GIGABYTE has produced a board that is equal parts beast and beauty.
Hi-Fi Audio System- As a Built-in Sound Card
For Hi-Fi Audio Solution, can be grouped into 2 parts.
Audio Signal Process, not distorted digital signal go through ESS 9218 Sabre DAC for Digital/Analog converter with 130dB SNR, 112dB THD+N and supports higher impedance up to 600 Ω headphone. Further, audiophile grade capacitor and gold plated audio jack ensures the non-compensated audio performance. Audio Signal Optimization, TXC Oscillator provides precise time triggers to Digital-Analog Converters. WIMA Capacitors to deliver crystal and balanced sound.
GIGABYTE is reputable for its durability and high quality manufacturing process. Needless to say, we use the best components we can find on the X570 AORUS XTREME and reinforce every slot to make each of them solid and durable.
GIGABYTE BIOS & APP CENTER
GIGABYTE is famous for its durability and high quality manufacture process, needless to say, we use the best components we can find on X570 AORUS XTREME and reinforce on every slot to make it solid durable.SPECIFICATIONS
|CPU||AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/ AMD Ryzen™ with Radeon™ Vega Graphics processors|
|Wireless Communication module||
|Expansion Slots||Integrated in the CPU (PCIEX16/PCIEX8):
|Storage Interface||Integrated in the CPU (M2A_SOCKET):
|USB||Integrated in the CPU:
|Internal I/O Connectors||
|Back Panel Connectors||
|I/O Controller||iTE® I/O Controller Chip|
|Operating System||Support for Windows 10 64-bit|
|Form Factor||E-ATX Form Factor; 30.5cm x 27.0cm|
|Note||***Features, Price and Specifications are subject to change without notice.|